| Items | Technology capability | |
| Layer count | 1-62 layer | |
| Max manufacturing size | 1-2 layer | 600mm*2000mm |
| Multilayer | 530mm*1100mm | |
| Board thickness | 0.05mm—10.0mm | |
| Copper foil thickness | 0.25OZ-13OZ | |
| Min line width/space | 2.5 mil / 2.5 mil | |
| Outline tolerance | Punching | +/-0.15mm |
| Routing | +/-0.10mm | |
| Min hole | Mechanical | 0.15mm |
| laser | 0.075mm | |
| Impedance control tolerance | +/-8% | |
| Aspect ratio | 18:01 | |
| Surface treatment | Immersion Gold(ENIG), Immersion Tin, Immersion Silver, Gold Fingers, ENEPIG,Flash Gold, Hard Gold(max Au>3UM), Wire bondable soft gold, lead free HASL, HASL, OSP... | |
| Material Types | TG135, TG150, TG180, TG200, TG250; FR4,Polymide, High frequency (RO4350B, RO4003C,RO4450F, RT5880, RO3003, F4BM…) | |
| Materials suppliers | Shengyi,ITEQ,Rogers,Panasonic,TUC,KB, Berguist… | |
