Views: 2 Author: Site Editor Publish Time: 2025-09-23 Origin: Site
Application Scenarios
Rigid-Flex PCBs excel in space-constrained and dynamic environments. In consumer electronics, they power foldable phones (enabling hinge flexibility) and smartwatches (integrating rigid control boards with flexible wearables). In automotive systems, they fit curved dashboards and connect sensors in engine bays. The aerospace/medical fields rely on them too—e.g., in miniaturized satellites (reducing weight) and portable medical devices (adapting to body contours).
Technical Specifications
1.Flexible Layers: Use polyimide (PI) substrates (thickness: 12-50μm) for high flexibility and heat resistance (-55°C to 125°C).
2.Rigid Layers: Employ FR-4 (Tg ≥130°C) for structural stability.
3.Conductors: Copper foils (18-35μm); electroplated to 35-70μm for high current.
4.Bending Cycles: ≥10,000 cycles (180° bend, radius ≥1mm) without performance loss. 5.Insulation: Coverlay (PI-based) with dielectric strength ≥2kV/mm.
