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Metal Substrate PCBs feature distinct technical parameters optimized for thermal management. Typically using aluminum, copper, or iron as base materials, they have a thermal conductivity range of 1-200 W/m·K, with copper substrates offering the highest efficiency. The dielectric layer, often 50-200μm thick, uses thermally conductive materials like epoxy resin or polyimide, ensuring electrical insulation while facilitating heat transfer. They support copper trace thicknesses of 18-105μm and operate within -55°C to 150°C.
Functionally, these PCBs excel in dissipating heat from high-power components, preventing overheating and extending device lifespan. Their rigid metal base provides structural stability, reducing vibration-related damage. The combination of thermal efficiency and mechanical strength makes them ideal for LED lighting, power supplies, automotive electronics, and industrial control systems, where reliable heat management and durability are critical.
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